Advances of 3D Integration and Packaging

“Another direction of improvement (of computing power) is to make physical machines three dimensional instead of all on a surface of a chip (2D). That can be done in stages instead of all at once – you can have several layers and then add many more layers as time goes on.”

Richard P. Feynman, “The Computing Machines in the Future,” presented at Gakushuin University (Tokyo), August 9, 1985.

This book is available online at https://books.3dic.org

本书的中文版链接为 https://bookz.3dic.org